Kits de développement
NXP i.MX 8
NXP avec la famille i.MX 8 propose des solutions multicœurs avec une évolutivité et des performances adaptées aux différents usages et systèmes. Avec ses processeurs à un, deux ou quatre cœurs, basés sur l’architecture ARM Cortex (Cortex-A72, Cortex-A53, Cortex-A35, et coprocesseurs Cortex-M4 et xCortex-M7), PHYTEC vous propose avec les SOMs équipés de ces processeurs des solutions de calcul adaptées à un large éventail d’applications :
- Graphisme, imagerie et vision industrielle
- Applications critiques de sécurité
- Passerelles multi-protocoles, contrôleurs industriels et systèmes robotiques
- Applications audio, vidéo et IA
phyCORE-i.MX 8M Plus | phyCORE-i.MX 8M Mini | phyCORE-i.MX 8M Nano | phyCORE-i.MX 8M | phyCORE-i.MX 8 | phyCORE-i.MX 8X | |
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CPU | Quad/QuadLite: 4x Cortex-A53 (1.8 GHz) Dual: 2x Cortex-A53 (1.8 GHz) | Quad/QuadLite: 4x Cortex-A53 (1.8 GHz) Dual/DualLite: 2x Cortex-A53 (1.8 GHz) Solo/SoloLite: 1x Cortex-A53 (1.8 GHz) | Quad/QuadLite: 4x Cortex-A53 (1.5 GHz) Dual/DualLite: 2x Cortex-A53 (1.5 GHz) Solo/SoloLite: 1x Cortex-A53 (1.5 GHz) | Quad: 4x Cortex-A53 (1.5 GHz) Dual: 2x Cortex A53 (1.5 GHz) QuadLite: 4x Cortex-A53 (1.5 GHz) | QuadMax: 2x Cortex-A72 (1.6 GHz) 4x Cortex-A53 (1.2 GHz) QuadPlus: 1x Cortex-A72 (1.6 GHz) 4x Cortex-A53 (1.2 GHz) | QuadXPlus: 4x Cortex-A35 (1.2 GHz) DualXPlus: 2x Cortex-A35 (1.2 GHz) DualX: 2x Cortex-A35 (1.2 GHz) |
Architecture | ARM Cortex-A53 / Cortex-M7 | ARM Cortex-A53 / Cortex-M4 | ARM Cortex-A53 / Cortex-M7 | ARM Cortex-A53 / Cortex-M4 | ARM Cortex-A53 / Cortex-A72 / Cortex-M4F | ARM Cortex-A35 / Cortex-M4F |
Instruction Set | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit |
Frequency | up to 1.8 GHz | up to 1.8 GHz | up to 1.5 GHz | up to 1.5 GHz | up to 1.6 GHz | up to 1.2 GHz |
Performance | 3450 to 16,560 DMIPS | 3450 to 13,800 DMIPS | 3450 to 13,800 DMIPS | 5860 to 28,650 DMIPS | 5040 to 7240 DMIPS | |
DSP | Tensilica HiFi 4 800 MHz | - | - | - | Tensilica HiFi 4 666 MHz | Tensilica HiFi 4 666 MHz |
Neural Network Accelerator | 2,3 TOPS | - | - | - | - | - |
GPU | GC7000UL (2 shaders) 166 million triangles/s 1.0 giga pixel/s 16 GFLOPs 32-bit | GC NanoUltra 3D (1 shader ) + GC30 2D (6,4 GFLOPs) | GC7000UltraLite (2 shaders) | GC7000Light (4 shader) (25,6 GFLOPs) | 2 x GC7000XS/VX (8 shader) (128 GFLOPS) | GC7000Light (4 Shader) (25,6 GFLOPs) |
OpenGL/VG/CL | OpenGL ES 2.0/3.0/3.1, Vulkan, OpenCL1.2 | OpenGL/ES 1.1, 2.0, OpenVG 1,1, Vulkan | OpenGL ES 3.1, Vulkan, OpenCL 1.2 | OpenGL/ES 1.1, 2.0, 3.0, 3.1, OpenCL1.1/1.2FP, Vulkan | OpenGL/ES3.2, 3.1, 3.0 (2.x, 1.x), OpenVX 1.01, OpenCL2.0 16 Vec4 shaders with 64 execution units (Split GPU for dual independent 8-Vec4 shader GPUs possible), OpenVG1.1, Vulkan | OpenGL/ES 1.1, 2.0, 3.0, 3.1 OpenCL 1.2 FP, Vulkan |
ISP (Image Signal Processor) | 2x ISP up to 12 MP resolution | - | - | - | - | - |
VPU | Decode: 1080p60 video decoding (H.265, H.264, VP9, VP8) Encode: 1080p60 video (H.265, H.264) | Decode: 1080p60 VP9 decoder,1080p60 HEVC/H.265, 1080p60 AVC/H.264, 1080p60 VP8, Encode: 1080p60 AVC/H.264 encoder, 1080p60 VP8 encoder | - | Decode: 4kp60 HEVC/H.265, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVC, MJPEG, H.263 | Decode: 4kp30 H.265, 1080p60 H.264,1080p30 H.264 | Decode: 4kp30 H.265, 1080p60 H.264,1080p30 H.264 |
HW Security | Secure boot, TrustZone, SNVS, SRTC, SJC | HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG | HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG | HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG | HAB secure boot, Arm TrustZone®, RNG, RSA up to 4096, AES- 128/192/256, 3DES, ARC4, MD-5, SHA up to 512, flashless SHE, ECC, secure JTAG, 4x tamper pins | HAB secure boot, TrustZone, RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 512, flashless SHE, ECC, secure JTAG, 10x tamper pins |
HW Crypto | RDC, CAAM, PKHA, RSA, EEC, RTIC, DRM, RSA, AES, 3DES, DES, RNG | AES, RSA, SHA-256, 3DES, DES, ECC, ARC4, MD5, TRNG | AES, RSA, SHA-256, 3DES, DES, ECC, ARC4, MD5, TRNG | AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG | AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG | AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG |
phyCORE-i.MX 8M Plus | phyCORE-i.MX 8M Mini | phyCORE-i.MX 8M Nano | phyCORE-i.MX 8M | phyCORE-i.MX 8 | phyCORE-i.MX 8X | |
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NAND Flash | - | - | - | - | 128 MB to 1 GB (optional with eMMC) | |
SPI NOR Flash | 8 MB - 256 MB Quad SPI Flash | 8 MB - 256 MB Quad SPI Flash | 8 MB - 256 MB Quad Spi Flash | 64 MB - 256 MB Octal SPI/Dual SPI Flash | 64 MB - 256 MB Octal SPI/Dual SPI Flash | |
eMMC | 4 GB - 128 GB | 4 GB - 128 GB | 4 GB - 128 GB | 4 GB - 128 GB | 4 GB - 128 GB | 4 GB - 128 GB (optional with NAND Flash) |
LPDDR4 RAM | 512 MB - 4 GB (32 Bit) x16 or x32 LPDDR4/ Inline ECC | 512 MB - 4 GB (32 Bit) | 256 MB - 2 GB (16 Bit) | 512 MB - 4 GB (32 Bit) | 1 GB - 8 GB (64 Bit) | 512 MB - 4 GB (32 Bit) |
EEPROM | 4 kB | 4 kB | 4 kB | 4 KB | 4 kB |
phyCORE-i.MX 8M Plus | phyCORE-i.MX 8M Mini | phyCORE-i.MX 8M Nano | phyCORE-i.MX 8M | phyCORE-i.MX 8 | phyCORE-i.MX 8X | |
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Ethernet | 2x 10/100/1000 Mbit/s (1x TSN) | 1x 10/100/1000 Mbit/s | 1x 10/100/1000 Mbit/s | 1x 10/100/1000 Mbit/s | 2x 10/100/1000 Mbit/s (1x onboard / 1x RGMII) | 2x 10/100/1000 Mbit/s (1x onboard / 1x RGMII) |
USB | 2x USB 3.0 Type C with PHY | 2x USB 2.0 OTG | 1x USB 2.0 OTG | 2x USB 3.0 | 1x OTG, 1x USB 3.0 | 1x OTG, 1x USB3.0 |
UART | 4x | 4x | 4x | 2x | 2x | |
CAN | 2x (1x CAN FD) | via SPI to CAN-FD Converter possible | via SPI to CAN-FD Converter possible | via SPI to CAN-FD Converter possible | 2x | 3x |
PCI / PCIe | 1x PCIe Gen 3 | 1x | - | 1x | 2x | 1x |
I²C | 3x | 3x | 4x | up to 19x | up to 10x | |
SPI | 2x | 2x | OSPI 2x SPI | up to 4x + 1x QSPI | 1x OCTAL SPI or 2x Quad SPI + 3 SPI | |
MMC/SD/SDIO | 3x SDIO (1 used for eMMC) | 2x | 2x | 1x SDIO | 2x | 1x (only with eMMC available) |
Keypad | - | - | - | 1x | yes | |
PWM | up to 4x | 4x | 4x | yes | yes | |
A/D | via I²C AD Converter | via I²C AD Converter | via I²C AD Converter | 8x | 6x | |
SATA | - | - | - | 1x | - | |
Display | LVDS (4/8-lanes), MIPI DSI (4-lanes), HDMI 2.0a Tx | LVDS or DSI-2 (1x 1080p60) | LVDS or DSI-2 (1x 1080p60) | MIPI DSI, HDMI (1x 4Kp60 HDR and 1x 1080p60) | 2x LVDS, 2x MIPI DSI, 1x HDMI (1x UltraHD 4Kp60 display or up to 4x independent FullHD 1080p60 displays) | 2x LVDS or 2x MIPI DSI, 1x Parallel (2x 1080p, 1x WVGA ) |
Audio | 18x I²S TDM (32 b @ 384 KHz), ASRC, 8-ch. PDM DMIC input, eARC | 4x SAI | 4x SAI | 5x SAI | 2x SAI up to 4 SAI | 4x SAI |
Camera | 2x MIPI CSI (4 lanes each) | 1x MIPI CSI-2 | 1x MIPI CSI-2 | 2x MIPI CSI | 2x MIPI CSI, 1x HDMI in | 1x MIPI CSI, 1x parallel |
phyCORE-i.MX 8M Plus | phyCORE-i.MX 8M Mini | phyCORE-i.MX 8M Nano | phyCORE-i.MX 8M | phyCORE-i.MX 8 | phyCORE-i.MX 8X | |
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RTC | Low power, high precision external RTC | Low power, high precision external RTC | i.MX 8 internal | i.MX 8 internal | i.MX 8 internal | |
Power Supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | |
Dimensions | 40 mm x 37 mm | 40 mm x 37 mm | 55 mm x 40 mm | 73 mm x 45 mm | 52 mm x 42 mm | |
Connectors | 319 solder pads, 1.27 mm pitch Fused Tin Grid Array (FTGA) | 319 solder pads, 1.27 mm pitch Fused Tin Grid Array (FTGA) | 501 solder pads, 1.27 mm pitch Fused Tin Grid Array (FTGA) | Samtec 0.5 mm pitch (480 pins) | Samtec 0.5 mm pitch (280 pins) | |
Temperature range | -40°C to +85°C | -40°C to +85°C | -40°C to+85°C | -40°C to+85°C | -40°C to +85°C |